Curated with aloha by
Ted Mooney, P.E. RET
The authoritative public forum
for Metal Finishing 1989-2025
-----
Dielectric Layer over Au
I have 500 µm diameter Au surface patterned using photolithography technique. I need to put down a dielectric layer to protect that gold for the remaining fabrication. I am seeing delamination of PECVD oxide (1 um) from the Au surface with a thin layer of Ti as an adhesion problem. I was wondering if there is a way to eliminate this adhesion issue.
Chris- Ithaca, New York
2001
Your problem may be more of stress in the oxide film than adhesion itself. Deposit a series of thinner films and see if peeling goes away. If it does, see if increase in PECVD process pressure could reduce the stress. I don't recall all the details but that may work. If stress is not the problem, metal surface preparation needs to be looked into.
Mandar Sunthankar- Fort Collins, Colorado
2001
(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)
Q, A, or Comment on THIS thread -or- Start a NEW Thread
Q, A, or Comment on THIS thread -or- Start a NEW Thread