Plating blisters observed on tin finish after annealing

Q. Hi. Good day. We have been experiencing an on/off plating blisters problem for about a year. Our machine has been processing different types of packages and has affected only a certain pkg. Our Electroclean is anodic, has separate descale tanks for copper and alloy based materials, uses MSA for predip. It is observed that the plating blisters is occurring at the bottom side of the copper based lead frame. When the plating blister has been forcefully open, we observed a thin tin plating. Would like to know what are your thoughts on this and also would like to know if this is really a valid plating blister or a blob?(based on the recent treads I read)

JS
- Philippines
August 21, 2024

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