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Electroplating onto a pattern with geometric shapes

March 21, 2014

Q. Is it possible to have an array of square pillars that are covered by a copper seed layer, and then electrodepositing copper on top of this in such a way that the plated film holds the morphology of the initial pattern?

Imagine a city block with houses all the same size and evenly spaced, cover them in a copper layer and then plate copper on top. Will the end film look like the initial seed layer?

If so, what kind of bath would encourage this(high/low macro throwing power) and what plating technique (pulse or DC).

Thanks!

Luke Prestowitz
- wilmington, New York

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