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Ted Mooney, P.E. RET
Pine Beach, NJ
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for Metal Finishing since 1989
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Solderability Problem with ENIG Finish on PCB
May 25, 2011
We are using ENIG finish for Pb-free PCB assembly. We are having both side SMD population, we have noticed that during Top side reflow for few SMD components wetting not proper, and it is not for same component . And during PTH component hand soldering , PTH not filled and not covering 100 % pad of PTH ?
PCB supplier's reports shows thickness of nickel and Gold as per IPC standard.
Can some body explain us, reasons for same.
consultancy services - Mapusa-Goa, India
May 27, 2011
Hi Prakash,
Besides thickness, other properties like nickel corrosion (so called black nickel), P% in EN deposit and IG porosity may also play a part. Of course, solder paste quality and reflow profile setting are important too.
Regards,
David
David Shiu
- Singapore
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