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Platinum electroplating on mems device after fabrication

January 20, 2011

I am a PhD student working on mems. Recently my task is to deposit platinum metal on silicon trenches electrochemically. The device I am playing is already fabricated using SOI wafer. My questions are:

1. What type of pre treatment could be used before electroplating? As I am worried that if I use HF etchant to remove silicon oxide from trenches then that could affect silicon dioxide box layer.

2. What type of drying treatment should be used to dry out excess water etc from device? I have read about spin drying but I could not use that as structure is released.

3. Bond pads on my device structure are of gold, so how will the gold bond pads react to platinum electroplating process and solution?

Sukhdeep Kaur
PhD student - Sandefjord, Vetsfold, Norway