No passwords, No popups, No cost, No AI:
we earn from 'affiliate link' purchases, making the site possible

Home /
T.O.C.
Fun
FAQs
Good
Books
Ref.
Libr.
Adver-
tise
Help
Wanted
Current
Q&A's
Site 🔍
Search
ted_yosem
Sound technical content, curated with aloha by
Ted Mooney, P.E. RET
Pine Beach, NJ
finishing.com -- The Home Page of the Finishing Industry

  The authoritative public forum
  for Metal Finishing since 1989
  mfhotline


  -----

Dull, non-adherent 'patches' from acid copper electrolyte




We have an issue that neither our staff or those of the chemistry suppliers can identify, but it is beginning to cripple our production output!
We are using an acid copper to panel and pattern plate PCB's and we have what appears to be an intermittent problem that causes dull, brown-pink, non-adherent powdery deposits in the centre of large copper areas. It's almost like high CD burning, but in the lower CD areas! When it manifests itself you will also see powdery, fluffy deposits of copper in any plated through holes in the affected area. CD will be in the range of 15-30 ASF.
The copper baths check out fine analytically, and Hull cells give no indication of any issues with the additive levels. We have seen the same problem occur in copper baths from two different suppliers, so the fault must lie with our equipment or how we are operating the baths. We are rapidly running out of ideas, apart from ripping our rectifiers to pieces and changing all the diodes, in case they are breaking down.
Any thoughts or similar experiences would be welcome!

Trevor Barrett
PCB Manufacturer - Chelmsford, ESSEX, United Kingdom
May 24, 2010



Trevor,
Because you said the problem is intermittent, I would examine the rectifier later. There are a few things I would check out first. Take a few anodes out and make sure they don't have a grayish brown sludge - like buildup on them. If they do the bath needs carbon treatment. The film on the anodes should be a thin black film. Keep the chloride ion between 50 and 90 ppm. High chloride can lead to anode polarization. Make sure all of the photoresist is removed in the developing step. Keep your acid cleaner changed on a regular basis, as well as the acid dip. Have you set up a small plating cell (not a hull cell) in the lab trying to duplicate the problem? I use a liter beaker [beakers on eBay or Amazon [affil links] with a sample piece of board that has been through imaging and developing. Hope this helps you.

Mark Baker
process engineer - Malone, New York
May 26, 2010



Hi Trevor,

might be an idea to check as well that the contacts are in good conditions and area(s)well contacted.

Cheers

Dominik Michalek
- Melbourne, Australia
May 28, 2010



May 29, 2010

DEAR SIR, I WILL SUGGEST TO CHECK YOUR ANODES QUALITY AND QTY. OF PHOSPHOROUS IN THAT IT SHOULD BE .03 TO .06% .
CHECK YOUR ANODE BAGS AND THEIR POROSITY.
PROPER FILTRATION FILTER CARTRIDGE POROSITY.
IF EVERY THING IS OK I WILL SUGGEST TO DECANT YOUR SOLUTION.
REGARDS,

ajay raina
Ajay Raina
Ludhiana, Punjab, India




(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)

Q, A, or Comment on THIS thread -or- Start a NEW Thread

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories:

Finishing
Jobshops
Capital
Equipment
Chemicals &
Consumables
Consult'g,
& Software


About/Contact  -  Privacy Policy  -  ©1995-2024 finishing.com, Pine Beach, New Jersey, USA  -  about "affil links"