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Ted Mooney, P.E. RET
Pine Beach, NJ
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Cathode Trouble
I am new to electroplating and have run into a couple of problems. I am trying to copper plate(w/ copper sulphate ⇦this on eBay or Amazon [affil links] solution) some Si wafer chips (~2cm X 2cm) that have a layer of Ti sputtered on top. I am running into problems with the copper adhering to the wafer. I used a steel alligator clip (w/ covering) to attach the wafer cathode to the power supply. The copper is drawn to the steel clips and coats to that but not the wafer. I am wondering if anyone knows a better way to wire the cathode. Again I am new to electroplating, so I might be doing somewthing else wrong. Thanks, I would appreciate any help!
Ben PepinEngineering Research Student - Columbia. Missouri, United States
February 11, 2010
February 17, 2010
Ben,
How are you activating the Ti? Information on your process would give some clues into your problem.
Regards,
Tom Horn
- Indianapolis, IN, USA
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