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Sound technical content, curated with aloha by
Ted Mooney, P.E. RET
Pine Beach, NJ
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Cathode Trouble




I am new to electroplating and have run into a couple of problems. I am trying to copper plate(w/ copper sulphate this on eBay or Amazon [affil links] solution) some Si wafer chips (~2cm X 2cm) that have a layer of Ti sputtered on top. I am running into problems with the copper adhering to the wafer. I used a steel alligator clip (w/ covering) to attach the wafer cathode to the power supply. The copper is drawn to the steel clips and coats to that but not the wafer. I am wondering if anyone knows a better way to wire the cathode. Again I am new to electroplating, so I might be doing somewthing else wrong. Thanks, I would appreciate any help!

Ben Pepin
Engineering Research Student - Columbia. Missouri, United States
February 11, 2010



February 17, 2010

Ben,

How are you activating the Ti? Information on your process would give some clues into your problem.

Regards,

Tom Horn

Thomas Horn-CEF
- Indianapolis, IN, USA




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