Hobbyists & Industry luminaries alike learn on every visit
(we earn from 'affiliate link' purchases)

Curated with aloha by
Ted Mooney, P.E. RET

finishing.com -- The Home Page of the Finishing Industry

  The authoritative public forum
  for Metal Finishing 1989-2025

-----

Copper electroplating onto tantalum sputtered silicon substrate

Hello. I'm currently doing a project to characterise copper delayering. I need to electroplate a layer of copper onto a thin layer of Ta which is being sputtered on a 2" blanket silicon wafer. I've tried to electroplate at a constant voltage of -1V and -2V for 1 hr. However, it doesn't seem to plate onto the surface. The electrolyte is made up of Cu2SO4.5H2O and H2SO4. Hence, I need help on this so that I can proceed with my research. Thank you.

mz ng
student - Singapore
October 8, 2009

(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)

Q, A, or Comment on THIS thread -or- Start a NEW Thread

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories: