No passwords, No popups, No cost, No AI:
we earn from 'affiliate link' purchases, making the site possible

Home /
T.O.C.
Fun
FAQs
Good
Books
Ref.
Libr.
Adver-
tise
Help
Wanted
Current
Q&A's
Site 🔍
Search
ted_yosem
Sound technical content, curated with aloha by
Ted Mooney, P.E. RET
Pine Beach, NJ
finishing.com -- The Home Page of the Finishing Industry

  The authoritative public forum
  for Metal Finishing since 1989
  mfhotline


  -----

Electroplating Failure Analysis




September 18, 2008

Hi,

I am working in electroplating industry as process engineer ,

we have several problems in plated parts
1. Stain in A-2 PLATING , TOFSIMS AND EDX shows high sodium and carbon content in stained part . We never use sodium in plating process ,but how sodium concentration increases ?

2. In nickel -nickel phosphorous plating the grain size in the SEM IMAGE VARIES THE ONE WITH WELL DEFINED GRAIN SIZE SUITABLE FOR WIRE BONDING WHEREAS the other film like not suitable for wire bonding

3. The frame plated with cu alloy 7205 shows copper peeling after 1 month

please give suggestions to solve the above problems

Thanks & regards
k.ganga

KANNAIYAN GANGA
PROCESS ENGINEER - SINGAPORE



September 18, 2008

Hi, K.

1. Sorry, but I don't know what you mean by A-2 Plating. You have good tools there but I have never enjoyed success in fixing a plating problem by analysis of the plated part, only by starting back at the plating tank. What name does your plater assign to these stains?

2. Does nickel - nickel phosphorous mean that you do both electrolytic and electroless nickel on the parts? The well-defined grain may be large soft grains resulting from minimal use of brighteners in an electrolytic process; brighteners may make it difficult to wire bond.

3. When copper or other plating peels it usually indicates that the substrate was not properly pretreated; either it was not truly clean, or the passive metal surface was not properly activated.

Please try to spend some time right at the plating line and tell us what kind of stuff you are seeing there. Good luck.

Regards,

Ted Mooney, finishing.com
Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey



Regarding wire bonding. It appears that you are using electroless nickel. High Phosphorus (10% or more) deposits with a small grain size. The high phosphorus interferes with wire bonding. The larger crystallites indicate low phosphorus and better wire bonding. Ultrasonic bonding on nickel requires higher energy than for bonding to copper, gold. Higher energy not more pressure.

don baudrand
Don Baudrand
Consultant - Poulsbo, Washington
(Don is co-author of "Plating on Plastics" [on Amazon or AbeBooks affil links]
           and "Plating ABS Plastics" [on Amazon or eBay or AbeBooks affil links])
September 22, 2008




(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)

Q, A, or Comment on THIS thread -or- Start a NEW Thread

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories:

Finishing
Jobshops
Capital
Equipment
Chemicals &
Consumables
Consult'g,
& Software


About/Contact  -  Privacy Policy  -  ©1995-2024 finishing.com, Pine Beach, New Jersey, USA  -  about "affil links"