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Solder Lump build up on tin lead plated terminal

We are doing reel to reel plating of connector terminals. Recently we had a problem of solder lump built up on the carrier of the tin lead plated terminal. We have found that our anode basket was not fully covered by the anode bag. We have fixed the anode bag problem but we are still seeing such problem. Can anyone help to suggest where the excess solder build up came from?

Mok Yeh Nan
Electroplating of connector terminals - Penang, Malaysia
2006

Check the filtration efficiency. What filter rating you are using right now. Do the flocculant treatment to completely weed out the problem.

Prince
- Semiconductor plating engineer, Chennai, India
2006

Thank you for your reply,Prince. We have found the root cause of the problem. The lump was created by the customer's assembly machine. However we will take your advise to treat our tank in order to prevent any potential problem in the future.

Mok Yeh Nan
- Penang, Malaysia
2006

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