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Copper on steel

We need plating 100 microns of copper on steel.

As first step we pickling and cleaning the piece, then we plating four or five microns of nickel, in watts bath (or copper, in cyanide bath).

After rinsing and activating (sulfuric acid 5%), the piece remains five minutes in air (situation that we cannot change). Then we Plating the 100 microns, whit acid copper bath.

But, we cannot obtain any adherence between both deposits.

Could someone help us?

Norberto G. Martin
- Buenos Aires, Argentina
2000

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First of two simultaneous responses--

5 minutes in air is a virtual guarantee of failed adhesion. I do not see any other answer for it. Why can't you delay the activation step 4 minutes?

By putting a fog spray of water over (on) the parts, it will delay the oxidation some. Maybe a minute or two.

James Watts
- Navarre, Florida
2000

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Second of two simultaneous responses--

Dear Mr. Martin,

I believe your problem is related to the Ni Strike which according to my experience in Cu plating grounding rods, should be All Chloride ( approx 250 g/l of NiCl2.6H2O 30 g/l H3BO3 and a pH about 1.2 kept w/ HCl) and NOT WATTS type.

Let me know trough our Hot Line if I can be of further help

Best Regards

Domingos J C Spinelli
SurTec do Brasil Ltda - S B Campo SP Brasil
2000

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Dear Sirs.

I have been thinking about the "globalization" like a way to help or support developed countries. E.g.: One liter of Cu-Link Part A of Atotech is paid in Argentina 25 US$ when in USA you have it for only 5 US$.

But you and Internet make me see another thing. How to learn without a teacher?

I appreciate your help and teaching, thank a lot. Of course, I will put in practice all your recommendation. I will show you the result, as soon as I could.

Norberto G. Martin
- Buenos Aires, Argentina
2000