No passwords, No popups, No AI, No cost:
we earn from your affiliate purchases

Home /
T.O.C.
Fun
FAQs
Good
Books
Ref.
Libr.
Adver-
tise
Help
Wanted
Current
Q&A's
Site 🔍
Search
ted_yosem
Sound technical content, curated with aloha by
Ted Mooney, P.E. RET
Pine Beach, NJ
finishing.com -- The Home Page of the Finishing Industry


  pub
  The authoritative public forum
  for Metal Finishing since 1989

-----

Good adhesion material for Si substrate and Gold?




I'd like to deposit Gold on Si substrate. But, the adhesion between the Gold and Si isn't good. So, I used Ti for good adhesion. However, the problem is the Ti is hard to deposit in evaporator. Is there any other metal that substitute the Ti?

Kwang An
U. of M. - Ann Arbor
2006


I believe Ti is the most common adhesion layer for gold evaporation. I know we use Ti with Au and Si all the time in our evaporation system, with no problem. I have also heard of using chrome and then gold in an evaporator, but I have no experience with that. You might also look into nickel.

Brad Blakestad
- Boulder, Colorado, USA
2006




(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)

Q, A, or Comment on THIS thread -or- Start a NEW Thread

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories:

Finishing
Jobshops
Capital
Equipment
Chemicals &
Consumables
Consult'g,
& Software


About/Contact  -  Privacy Policy  -  ©1995-2024 finishing.com, Pine Beach, New Jersey, USA  -  about "affil links"