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Problems with adhesion of nickel sulphamate plating

I operate a Nickel Sulfamate Electroplating line. Our Etch / Pretreatment has always been 30% H2SO4 with 3% H2O2. This has produced excellent adhesion for years. I now have a new customer with the same chemical composition as all of my other customers that has given me real problems with adhesion. I'd like to try reverse etching. Can this be done with my current etch chemicals? If so, how long? What Amperage? If anyone has any suggestions I would greatly appreciate them.

Coult Giering
Quality Control Chemist - Titusville, Pennsylvania, USA
2006

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First of three simultaneous responses --

The customer says that it is the same material, but I will bet one common cup of coffee that it is really a "free cutting" material with a trace of lead in it. If it is, it will take a dip in fluoboric acid solution to get adhesion. On a scrap part, try cathodic at 2-5 ASF.

James Watts
- Navarre, Florida
2006

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Second of three simultaneous responses --

May we know what are you plating, how and for what purpose before we can comment?

Guillermo Marrufo
Monterrey, NL, Mexico
2006

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Third of three simultaneous responses --

Give details of your process and materials, then someone can tell you what is applicable and then help you.

Trevor Crichton
R&D practical scientist
Chesham, Bucks, UK
2006