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Ted Mooney, P.E. RET
Pine Beach, NJ

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Migration of aluminum through copper plating

i have a problem with a power amplifier heat sink. the he30 aluminum material is conducting the heat away from the power amplifier area slowly. to avoid this we have plated the al with 10 microns of cu and topped that with 10 micron of tin. there is an improvement but nothing dramatic. so here are my questions:
1) any better way of conducting the heat away quickly.
2) I am told that the aluminum will migrate through the cu and destroy it eventually. is this correct.

Sunil Devanahalli
power amplifier research and development - INDIA
2006

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