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Nickel/gold plating of aluminum

My problem concerns the level of "trapped" hydrogen in a sealed electronic module resulting from both electroless nickel and gold plating of aluminum parts. The module design calls for a conductive EMI interface between two mating aluminum parts. One half is electroless nickel plated while the other half is electroless nickel/gold plated.

Given the existing plating, is there any recommended post plating treatment to "bake out" the hydrogen? Or, should I be using different plating options to reduce the level of hydrogen? Thank you for any information regarding this subject of hydrogen with regard to plating types.

Steve McGowan
- Sunnyvale, California
1999

Hi Steve.

I don't think the part must bake after Electroless or Electroless gold to remove hydrogen. Because it is not so much hydrogen in a electroless plating solution it is approximately 100 percent exchange in the solution. But after Electroless nickel and gold plating should you bake the part in 374-410 Fahrenheit for one hour to have a better adhesion between the nickel and gold layer and the aluminium.

Regards,

Anders Sundman
4th Generation Surface Engineering
Consultant - Arvika,
Sweden
1999