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ted_yosem
Sound technical content, curated with aloha by
Ted Mooney, P.E. RET
Pine Beach, NJ
finishing.com -- The Home Page of the Finishing Industry


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Testing for Copper Contamination in Ni electroplating baths




I am the new chemist for an electroplating shop, and want to begin testing for copper contamination in my Ni baths. I want the test to show quantitative data, and am not really sure if there is already a procedure for this testing or if I need to design one myself.

Thanks for any help.

Angela Sincavage
Egide USA, Inc. - Cambridge, Maryland
2005



First of four simultaneous responses --

Generally people use AAS this on eBay or Amazon [affil links] or ICP if available. You might get away with UV-VIS depending on your situation. What do you have available?

James Totter
James Totter, CEF
- Tallahassee, Florida
2005



Second of four simultaneous responses --

Analyze the bath for copper (ppm) with an AA or ICP. Otherwise the only other way is not quantatative but by waiting until a dark lcd area appears on Hull Cell tests (1 amp/5 minute). The test panel can be misleading in that it would also show zinc contamination in a similar manner.

Gene Packman
process supplier - Great Neck, New York
2005



Third of four simultaneous responses --

Angela,
if you really must quantify it then you will need access to a atomic absorption instrument (AAS) this on eBay or Amazon [affil links] . If you work for a smaller plating shop that can't afford this instrument then the best way is to check copper contamination though plating a hull cell and looking for darkness in the LCD regions (although this could also be caused by zinc) and this won't obviously give you any numerical values. Ask the supplier of the plating chemicals to test the copper levels for you. All decent suppliers should be able to do this.

Peter Van de Luecht
- Melbourne, Vic, Australia
2005



Fourth of four simultaneous responses --

You will need to do a few tests; firstly do Hull Cell tests to get the copper contaminated nickel deposit. Observe the characteristics of the deposit and then do EDAX analysis to determine the amount of copper present. You can then correlate the amount of copper in the nickel to the visual characteristics as well as having a handle on how copper an nickel deposit relative to each other at different current densities. I suggest you use stainless steel panels, as normal Hull cell panels are brass and contain copper!

trevor crichton
Trevor Crichton
R&D practical scientist
Chesham, Bucks, UK
2005




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