Sound technical content, curated with aloha by
Ted Mooney, P.E. RET
Pine Beach, NJ
The authoritative public forum
for Metal Finishing since 1989
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Can you develop my plating process? Ni on Au
We are seeking a detailed PROCESS DESCRIPTION ONLY including all relevant process parameters to plate Ni onto Au, etch it off, and repeat.
The copper substrate is roughly 2.5" X 5" and would have gold permanently plated on it. The nickel layer will be plated on at our sites, we would perform our process on it, then the nickel layer would be etched off. This process is repeated many times.
The process should be very reliable, simple, and result in reproducible nickel layer thickness and excellent adhesion.
This has to be a very high quality plating.
Please contact me with questions, etc.
medical equipment manufacturer - Richmond, BC, canada
2005
2005
Although just about any plating consultant can give you starting points for the process, it doesn't become real and workable until the process is developed at a plating shop based on real world conditions. Plating just isn't that easy; there are always things you didn't fully anticipate.
You'll probably want to nickel plate the copper, before the gold plating to prevent interdiffusion of gold and copper. Are you sure you need to dissolve the nickel . . . that peeling it off wouldn't work?
Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey
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