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Bubble on Ni/Cu plated material

2005

I m doing Electrolytic Ni/Cu over steel and encounter Bubble issue.
These bubble are not to be seen after plating,There is a welding process after plating at 12KA 20 ms,bubbles appear immediately after welding

My process is Flash Nickel-Acid Copper-Nickel.
Any comments from gentlemens?


Thanks,

WHK
Consumer - Johor, Malaysia

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You may be able to see, from the color of the metal remaining on the part, and the color of the underside of the blister, which metal is failing to adhere. What is the substrate? We need your full name on your followup, Mr. Whk. Thanks.

Ted Mooney, P.E.
Striving to live Aloha
finishing.com - Pine Beach, New Jersey
2005

That's adhesion issue , major reason is pre-treatment is not well before plating copper, you can check it with baking process , for this issue , before I have done it , the spec is temperature 160 degree , and keep 15 min , if the part can stand this checking , I think most of parts will be no problem during welding .

Leaf
- Shanghai, China
2005