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Voids Resulting After The Reaction Of Nickel-plated Copper and Solder Paste

2005

hi!

I am a college instructor here in the Philippines. the name of the school is university of san carlos. actually, I would like to know the effects or the reaction between nickel plated copper and solder paste. is there voids after it? how to get rid of it?

thank you.

walton

walton b. lacorte
university of san carlos - Philippines

Yes,voids may appear in the system (joint). Solder paste has additives in it and during reflow outgassing is one major problem. When entrapped, this results to solder voiding.
However, this is a function "Die Attach" settings (temperature and time), you may want to play on this to address the problem.

Jerwin Separa
assembly and test of semiconductor - Metro Manila, Philippines
2007

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