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Ted Mooney, P.E. RET
Pine Beach, NJ
The authoritative public forum
for Metal Finishing since 1989
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Voids Resulting After The Reaction Of Nickel-plated Copper and Solder Paste
2005
hi!
I am a college instructor here in the Philippines. the name of the school is university of san carlos. actually, I would like to know the effects or the reaction between nickel plated copper and solder paste. is there voids after it? how to get rid of it?
thank you.
walton
university of san carlos - Philippines
Yes,voids may appear in the system (joint). Solder paste has additives in it and during reflow outgassing is one major problem. When entrapped, this results to solder voiding.
However, this is a function "Die Attach" settings (temperature and time), you may want to play on this to address the problem.
assembly and test of semiconductor - Metro Manila, Philippines
2007
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