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Tin electroplating

2005

I need to get a layer of tin onto a pure lead electrode. I am a materials scientist and have a theoretical understanding ofplating but have never performed the technique. I was hoping you could tell me the chemicals, concentrations, and current/potential processes to use to accomplish this task. I am assuming that I can modify the amount of tin deposited by varying the time. I have read about some of the differenct chemicals to utilize (tin sulphate vs. tin fluoborate) and am not sure which to use nor, which organic additives to utilize. Thanks for your help.

Best Regards,

Nicholas Brazis
electrochemistry - Bloomington, Illinois

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Clean the lead in an alkali to remove orgnic soil, rinse, dip in 50% fluoboric acid for 2 minutes, rinse, electroplate in a tin fluoboric acid solution, rinse, dry.

The tin sulphate system will form insoluble lead compounds in contact with the sulphate and there will be no adhesion.

Robert H Probert
Robert H Probert Technical Services

Garner, North Carolina

2005

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2005

Dear Nicholas,

I recommend to contact a plating chemical supplier, such as Enthone-OMI. They should have tin plating process for different applications.

Regards,

Dominik Michalek
- Mexico City, Mexico

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Q. I came across a paper on tin plating. In this article, they mentioned that in a tin acid bath, both stannous fluoborate and Shinol TWS agent are recommended for good adhesion coating. For some reason I can not find these compounds through web search; even the company who offers Shinol TWS could not be found. I found Stannous Fluoroborate from Sigma Aldrich; they do have some information but no longer sells it. Can someone help me in locating these compounds?

Thanks very much,
Eric

Eric Liu
- Santa Clara, CA, USA
May 21, 2012

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