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Electroless plating as a joining technology

2004

I was wondering if it would be possible to use plating as a joining technology. I have a small diameter wire (0.030") that protrudes through a piece of metallized alumina. The metal bonded in the alumina is a platinum-palladium-silver.

I need a good electrical connection between the two to be good to high temperatures. As a result, I can't use solder because they melt too low.

Since both materials are in good physical contact, can I use a plating process like electroless nickel to "join the two parts." I was thinking of just plating on 0.005-0.010" of electroless nickel.

Scott Billington
engineer - Atlanta, GA, USA

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First of two simultaneous responses --

EN or even electrolytic nickel could be an option, but acid copper is best for closing, bridging or jumping over separations. It resists well moderate temperature and can be top coated with almost any plateable metal.

Guillermo Marrufo
Monterrey, NL, Mexico
2004

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Second of two simultaneous responses --

Forget EN for those thicknesses. EN typically will range from 0.0005 to 0.0015".Next, you would not have enough metal surface to keep the tank active and it would eithe quit plating or plate out on the tank. You probably would not get one tank turnover. Is silver solder a possibility? Is brazing or dot welding or tig welding a possibility?

James Watts
- Navarre, Florida
2004