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Solder plate flaking from IC leads during trim and form

Hello all, does anyone have any experience in preventing / anticipating solder flakes during trim and form operation for tin-lead as well as pure tin plated parts, from plating chemical point of view as well as the tooling point of view?

Thanking you in advance.

Hari Setiawan
IC assembly - Batam, Riau, Indonesia
2004

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