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Thread 303/43

de-wetting of short leads, only, in tin dip process

Q. Using a tin dip process we encountered de-wetting on short leads only and none at all at high leads, what do you think is the problem? how to avoid de-wetting?

June Apolinar
student - Makati City, Philippines
2004
publicly reply to June Apolinar

A. de-wetting is generally caused by a contamination problem. An interruption occurs in the orderly growth of the intermetallic compound because of the presence of some unwettable material on or near the surface of the base metal. The base metal is covered by a layer of molten solder, which pulls back from the unwetted areas. The result is a thin <1 µm layer of intermetallic compound covered with little or no solder. If you are plating your own parts prior to solder process, make sure that you have a very clean, activated base metal preparation prior to final plate (gold?).

Tess Molina
- Hawthorne, California, USA
2004
publicly reply to Tess Molina

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