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Problem with high contact resistance with pure tin

When Sn/Pb plating is in use on the connector of a electrical device, the contact resistance between the tester pin and the connector stays low value.

However, after pure tin plating, it is found that the contact resistance between the tester pin and the connector increases a lot.

After plating process, normally it would stay in air for a day before go to the electrical test. So, does anyone know why it happens after pure tin plating is in use?

Man [surname deleted for privacy by Editor]
Engineer - HK, China
2003

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