Sound technical content, curated with aloha by
Ted Mooney, P.E. RET
Pine Beach, NJ
The authoritative public forum
for Metal Finishing since 1989
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Ni/Pd/Au finishing lead failed dipping solderability, possible causes
Hi all,
We have a part that failed the initial dipping solderability test. Symptoms are, we have a few leads in between good leads with solder good paste coverage, having NO solder paste sticking on them, not even at the cut/exposed copper surface of the lead. Cleaning have been done using Plasma & DI water jet, but the result was the same. Could it be caused by insufficient flux coverage, Cu migration, thick Gold plating, surface oxidation or others ?
SENG, SENGSOON- KUALA LUMPUR, SELANGOR, MALAYSIA
2003
2007
I have some solderability issue with components NiPdAu made in Malaysia.
I want to exchange on this subject .
I think may be is it a relation with the Pd Thickness ?
Christian
THALES - Verrieres le buisson FRANCE
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