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Ted Mooney, P.E. RET
Pine Beach, NJ

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Poor wettability of PCB gold finishing

Q. I would like to have some information about gold plating contaminants that produce a poor pads wettability when SMT components are mounted and reflowed. If someone have already had those evidences could tell me what are the reasons and how to eliminate them?

Thanks a lot,

Gianpietro D'Andrea
Marconiselenia - Latina, Italy
2003

A. Advice from former PCB worker : Try to check the gold thickness, typical reason for poor wettability is to thin gold layer, so nickel is oxidized.

Best regards,

Bo Kønig
- Denmark

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