Sound technical content, curated with aloha by
Ted Mooney, P.E. RET
Pine Beach, NJ

finishing.com -- The Home Page of the Finishing Industry

The authoritative public forum
for Metal Finishing since 1989
-----

Autocatalytic plating of Sn on Au bumps for microelectronics

Is there existence of an article or knowledge of industrial process to deposit Sn on Au Bumped Wafers with IC's by means of autocatalytic plating?

Armand Doornveld
Philips Semiconductors - Zurich, Switzerland
2003

I DON'T KNOW AUTOCATALYTIC SN TO PLATE ON AU BUT YOU CAN PLATE SN ELECTROLITICALLY IMMEDIATELLY AFTER YOU FINISHED TO PLATE THE AU BUMP. YOU STILL HAVE ALL THE ELECTRICAL CONNECTIONS ON THE OTHER SIDE OF THE BUMP.

WE DID 70 MICRONS OF GOLD AND 5-7 MICRONS OF TIN IN THIS WAY.

Ricardo Burstein
Bnei Berak, Israel
2003

(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)

Q, A, or Comment on THIS thread -or- Start a NEW Thread

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories: