Sound technical content, curated with aloha by
Ted Mooney, P.E. RET
Pine Beach, NJ

finishing.com -- The Home Page of the Finishing Industry

The authoritative public forum
for Metal Finishing since 1989
-----

Electroless deposition of Au and Cu

I have 200 micron deep holes 200 microns in diameter, they are in a Silicon wafer. I am looking to fill these holes with either Cu or Au and I was wondering if it would be possible to do electroless deposition?

Rick Morrison
- Stow, Massachusetts
2003

Electroless copper is needed before any gold, so its best to use copper. Try Atotek's Noviganth process.

Kevin Keating
- Rochester, New York
2003

(No "dead threads" here! If this page isn't currently on the Hotline your Q, A, or Comment will restore it)

Q, A, or Comment on THIS thread -or- Start a NEW Thread

Disclaimer: It's not possible to fully diagnose a finishing problem or the hazards of an operation via these pages. All information presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The internet is largely anonymous & unvetted; some names may be fictitious and some recommendations might be harmful.

If you are seeking a product or service related to metal finishing, please check these Directories: