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Ted Mooney, P.E. RET
Pine Beach, NJ

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Electroless deposition of Au and Cu

I have 200 micron deep holes 200 microns in diameter, they are in a Silicon wafer. I am looking to fill these holes with either Cu or Au and I was wondering if it would be possible to do electroless deposition?

Rick Morrison
- Stow, Massachusetts
2003

Electroless copper is needed before any gold, so its best to use copper. Try Atotek's Noviganth process.

Kevin Keating
- Rochester, New York
2003

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