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Letter 42092 Low temp. acid copper plating [Wisconsin]August 30, 2006 We have been playing around with room temp. plating for acid
copper (No heaters). At what temperature point, (High and low) will
we have problems? Can these problems be rectified through current
adjustment or other non-thermal means? Mike Kahn
First of five simultaneous responses -- September 1, 2006 Hi there,
Second of five simultaneous responses -- September 1, 2006 Most acid copper solutions I have worked with are run at room temperature. I know it gets cold in Wisconsin and you may have to heat the bath to keep it between 70-80 degrees F. What exactly do you mean by low temp? Lower than the bath supplier suggests? Obviously there is no benefit to operating at a lower temp as far as plating speed and thickness distribution are concerned. I would say 65-85 degrees F should be the normal parameter limits, but check with your supplier to make sure. I would not try to compensate with higher current. Your brightener system is designed to work within a given current density range. Mark Baker
Third of five simultaneous responses -- September 1, 2006 Optimum temp range for most acid copper plating process is between 22-28 deg C. Too low temp (below 20 deg C) will cause burning on high current density area while too high temp (above 30 deg C) will increase brightener consumption and fasten organic by-products build up and affect copper deposit ductility.
Fourth of five simultaneous responses -- September 2, 2006 No problem. If you can live with low current and long processing times. A lot of copper Eforming is done at room temp. Guillermo Marrufo
Fifth of five simultaneous responses -- September 3, 2006 Mike
September 6, 2006 Your supplier should have sent a data sheet with optimum pH and
plating temperature, amps per square foot, and additives to maintain
a stable solution,etc. Steve Clark
Dear Reader: please choose what you want to do--
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