Letter 38088

Gold peeling test on semiconductor devices [U.K.] 

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We are currently looking into how to test for gold peeling on the backside of small components average size from 1 mm to 5 mm surface area
We currently Epoxy place the components with no visible filet up the sides of the devices followed up with dice shear process
This does not give the best results because if the epoxy climbs the sidewalls of the components, you then have a false reading because you are testing epoxy strength not the gold adhesion (It is very hard to dispense small amounts of epoxy so that we achieve the correct bond line thickness or spread
We also have eutectic attached some devices but due to the heat applied this again
Can cause excessive heat on the plating process
Some suggestions we have had is place the device gold side up over and ball bond on to the surface .Followed up with ball shear test
Does any one have this particular problem and what do you suggests we do to tests our plating on small devices

Rob Naisbitt
Filtronic - AYACLIFFE, U.K.

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