Letter 36040

Ni-NiP vs. pure Ni Plating on Cu Leadframes  

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Dear Friends,

We are using Cu-based leadframes for our POWER transistor products. What would be the best plating technique for these Cu leadframes?
1. NiP over Ni over Cu material, or
2. pure Ni plating over Cu

What would be the advantages and disadvantages for each plating option in terms of quality and performance of the plating especially when subjected to high temperatures (150 - 260 deg C) and/or mechanical stress?

Many thanks,

Jun V. Idjao
semiconductors - Laguna, Philippines

What are you trying to accomplish with the plating?

Ron Duncan Palm International, Inc. - LaVergne, TN

Ed. note: It is our sad duty to alert the readers to the passing of Ron Duncan on Dec. 15, 2006. For those who would like to know more about him, a brief obituary opened Update No. 13 of our Metal Finishing Industry Update Podcast.

Hello Ron,
The plating should provide a good surface (at T-post) for Aluminum wire bonding and a reliable joint (at backside heatsink)once soldered to PCB...

which type (Ni or NiP) will give a better bond with Aluminum wire? and/or

good solder joint when soldered to PCB?

Jun Idjao
semiconductors - Laguna, Philippines

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