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Failure Analysis of Electronic Plating

1997

Hi!

We would like to do some failure analysis of electronic components, specifically lead plating metallurgy related failures. For surface mount copper leads with 60Pb/40Sn plating or Alloy42 leads with Ni/Pd plating, how can I determine if the correct intermetallics have formed? I know that solderability tests exist, but I am more interested in physically seeing the cross-sectioned leads with the inter-metallics? Also, what magnification would one need to visually see these layers?

Thanks

Sanjay Rajan

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Metallographic cross sections of solder joints require very high quality of sample preparation to reveal the intermetallic layers. This is always sample dependent, but you may need magnifications in excess of 1000X to even see the layers. Scanning electron microscopy may be able to allow you to determine the composition of the layers, but analytical transmission electron microscopy may be needed for a conclusive analysis.

Larry Hanke
Minneapolis, Minnesota
1997

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Buehler (Lake Bluff, Illinois), the metallographic people, recently sent a supplement to their Analyst catalog on this subject. It was interesting.

  
Tom Pullizzi
Falls Township, Pennsylvania
1997

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